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IWIPP 2019’s Technical Expertise

par Isabelle Clarysse - publié le

The International Workshop on Integrated Power Packaging (IWIPP) is a biennial IEEE event dedicated to advancing the state-of-the-art in power semiconductor packaging. Over the past several years, the technical community has increasingly recognized the importance of packaging technology in determining the performance and reliability of power electronics, especially with the emergence of wide band-gap (WBG) semiconductors. IWIPP is envisioned to foster and facilitate disruptive change in the development of power packaging technologies to support the development of next-generation power electronics.


The organizing committee is pleased to announce that the technical program for IWIPP 2019 has been finalized. The confirmed program includes plenary addresses to be delivered by technical experts from GE Global Research, Airbus Operations SAS, Toyota Research Institute of North America, and the French Institute of Science and Technology for Transport, Development, and Networks.

In addition, the program for IWIPP 2019 includes a set of focused tutorials as well as technical sessions in both oral and poster presentation format. These presentations will cover a broad range of related and relevant topics, including magnetic and dielectric materials ; power semiconductor devices and modules ; integration of sensors ; design of gate/base drivers, reliability and manufacturability considerations ; electro-magnetic interference mitigation ; and many more. The full program schedule can be accessed at the following link :


The online registration portal for IWIPP 2019 is now available. Please note that discounted registration rates are available through March 3, 2019. Prices for all registration levels will increase on March 4, 2019. The registration site can be accessed at the following link :

IWIPP 2019 will be held April 24-26, 2019, in Toulouse, a beautiful city on the banks of the River Garonne in southern France and the center of the European aerospace industry. Please make plans to attend IWIPP 2019 to enhance your understanding of the latest developments in the area of high-performance power packaging and the critical role of packaging in determining the performance and reliability of power electronics applications. Additional information regarding the conference, including local arrangements and registration rates, is available at

Sponsored by :
IEEE Power Electronics Society (PELS)
IEEE Electronics Packaging Society (EPS)
IEEE Dielectrics and Electrical Insulation Society (DEIS)
Power Sources Manufacturers Association (PSMA)
European Center for Power Electronics (ECPE)